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HT-90D double diagonal pearl table ball governance 90 * 90mm
Delivery term:The date of payment from buyers deliver within days- Price:
Negotiable
- minimum:
- Total supply:
- Delivery term:
The date of payment from buyers deliver within days
- seat:
Beijing
- Validity to:
Long-term effective
- Last update:
2017-07-20 19:37
- Browse the number:
195
Company Profile
- Xiamen Xintonglian Plastic Co., Ltd. By certification [File Integrity]
-
Contact:
szhonton(Ms.)
- Telephone:
-
Area:
Beijing
-
Address:
1/F No.568 Dongren 2nd West Road, Xingbei Industry Zone, Xinglin Town, Jimei DIstrict, Xiamen, Fujian, China (361022)
- Website: http://szhonton.midashipping.com/
Product details
Model Number: HT-90D double diagonal pearl table
Brand Name: HONTON
Key Specifications/Special Features:
90 * 90mm with handle bidirectional positioning diagonal universal BGA Taiwan stand tablesFeatures:1. easy operation;2. automatic locking and unlocking system;3. double-screw corners of simultaneous localization;4. with solder ball and solder balls poured a groove pantryApplied to the maximum BGA: 50X50mmApplicable to the smallest BGA: 5X5mmBody size: 90*90*32mm
Basic dimensions: 100 * 100 mm
Height: 80 mm
Exhibition process long: 196mm
Weight: 900 g
Stencil Dimensions: 89.5 * 89.5 mm
Steel mesh size: 81 * 81mm
Features:
1. there is a solder ball inside to store the lid, the structure does pour over surplus solder balls do not always need to pour, but stored in the structure, improve production efficiency
2. The lid with solder ball poured the slot, the structure will be within the light coating of excess solder balls poured
3. there are four adjusting screw heights, depending on the thickness of the IC can be adjusted on the bearing surface and the slide-lid is placed by the steel bumping distance relationship, for different base thickness IC bumping
4. Double screw driven slide support for synchronous motion (moving or at the same time shifting), to facilitate positioning of various IC sizes
5. Four corners IC can support the elevator slider, smooth diagonal positioning ratio, increased efficiency bumping.
Basic dimensions: 100 * 100 mm
Height: 80 mm
Exhibition process long: 196mm
Weight: 900 g
Stencil Dimensions: 89.5 * 89.5 mm
Steel mesh size: 81 * 81mm
Features:
1. there is a solder ball inside to store the lid, the structure does pour over surplus solder balls do not always need to pour, but stored in the structure, improve production efficiency
2. The lid with solder ball poured the slot, the structure will be within the light coating of excess solder balls poured
3. there are four adjusting screw heights, depending on the thickness of the IC can be adjusted on the bearing surface and the slide-lid is placed by the steel bumping distance relationship, for different base thickness IC bumping
4. Double screw driven slide support for synchronous motion (moving or at the same time shifting), to facilitate positioning of various IC sizes
5. Four corners IC can support the elevator slider, smooth diagonal positioning ratio, increased efficiency bumping.
Shipping Information:
- FOB Port: Shenzhen
- Lead Time: 2 - 5 days
- Dimensions per Unit: 145 × 125 × 95 Centimeters
- Weight per Unit: 0.8 Kilograms
- Units per Export Carton: 60
- Export Carton Dimensions L/W/H: 600 × 620 × 500 Centimeters
- Export Carton Weight: 50 Kilograms
Main Export Markets:
- Asia
- Australasia
- Central/South America
- Eastern Europe
- Mid East/Africa
- North America
- Western Europe
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